Thick-film process technology: in order to realize SMD of electronic devices, print the function materials (in the form of slurry) on the insulated substrate using the silk-screen printing process through the process platform technology, and then implement packaging through the package process after sintering, solidification, fragmentation, end termination and electroplating are completed.

Process advantages: process technology is stable and mature; material process has good compatibility, high yield, low cost and other characteristics.

Thin-film process technology: the metal thin film forms on the insulated substrate using the process platform technology through magnetron sputtering, and then the molding of functional layer is completed after the exposure and development of mask film and thin film etching technology are implemented through mask film yellow light process manufacture procedure. Implement the packaging through packaging process finally.

Process advantages: with high control precision and high integration, this process technology can achieve ultra-small size of volume. But the equipment used is more expensive, and the production cost is higher.

Alloy film mounted process technology: it refers to CSR product process technology; paste the prefabricated alloy sheet on the insulated substrate through a special process, and then conduct trimming to complete the molding of functional layer through the yellow light process manufacture procedure and etching technology. Implement the packaging through packaging process finally.

Process advantages: high control accuracy, low TCR parameters, good process compatibility, good yield, low cost and other characteristics.

Alloy stamping process technology: it refers to CSR product process technology; implement stamping forming for the prefabricated alloy sheet through the customized moulds and stamping equipment, then complete the functional molding through the a certain trimming technology, and finally implement packaging through the packaging technology.
Process advantages: high-power characteristic, ultralow impedance, etc.